SUBSTRATE CUTTING METHOD AND SUBSTRATE CUTTING APPARATUS INCLUDING CUT PORTION RECOGNITION STAGE AND CUTTING STAGE ARRANGED SEPARATED FROM EACH OTHER

摘要

PURPOSE: A substrate cutting method and a substrate cutting apparatus are provided to shorten the time required for cutting a sealed substrate. CONSTITUTION: A substrate cutting apparatus comprises a cut portion recognition stage(B) where a sealed substrate(1) having a cut portion and a mark is transferred; a unit for recognizing position relationship of the cut portion and the mark on the cut portion recognition stage; a cutting stage(C) where the sealed substrate on the cut portion recognition stage is transferred; a unit for detecting position of the mark of the sealed substrate loaded on the cutting stage; a unit for defining position of the cut portion of the sealed substrate loaded on the cutting stage, in accordance with the result of detection of position of the mark and position relationship of the cut portion and the mark; and a cutter blade for cutting the sealed substrate in accordance with the defined position of the cut portion.