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SITE CONSTRUCTION METHOD OF FLOOR INSULATION/INTERFLOOR NOISE PREVENTIVE MATERIAL BY USING WASTE SINGLE FIBER, FOR IMPROVING FLOOR THERMAL INSULATION AND EFFECTIVELY CUTTING OFF LIGHT AND HEAVY SHOCK NOISE BETWEEN FLOORS
SITE CONSTRUCTION METHOD OF FLOOR INSULATION/INTERFLOOR NOISE PREVENTIVE MATERIAL BY USING WASTE SINGLE FIBER, FOR IMPROVING FLOOR THERMAL INSULATION AND EFFECTIVELY CUTTING OFF LIGHT AND HEAVY SHOCK NOISE BETWEEN FLOORS
PURPOSE: A site construction method of a floor insulation/interfloor noise preventive material by using waste single fiber is provided to shorten a term of construction, to improve durability of finishing mortar, to reduce the construction cost, and to increase economical utility of industrial waste. CONSTITUTION: A site construction method for forming a floor insulation/interfloor shock noise preventive layer by spraying and paving waste single fiber below 3mm and organic and inorganic binder solutions in the site at the same time is composed of steps for passing a single fiber supplied from a waste single fiber storage container through a single fiber beating part at an initial part of a screw-type fixed quantity supply conveyor and a water spraying nozzle unit for controlling humidity and density and then transferring the single fiber to a single fiber pulp delivery and fixed quantity supply unit; sending the single fiber from the single fiber pulp delivery and fixed quantity supply unit to a construction layer in haste by pneumatic pressure supplied from a pneumatic compressor; sending an organic binder solution to the construction layer in haste by a pump; sending an inorganic binder solution to the construction layer in haste by a pump; and forming a floor insulation/noise proof layer at the predetermined thickness by mixing, spraying, and paving a single fiber pulp and the organic and inorganic binder solutions on the construction layer with the hasty sending pressure. A simultaneously mixing and spraying nozzle unit(15) mixes and injects the single fiber pulp and the organic and inorganic binder solutions.
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