HANDLING APPARATUS FOR CHIP TYPE ELECTRONIC COMPONENTS, INCLUDING CAVITY BUFFER PORTION WITH VOLUME LARGER THAN THAT OF PRESSURE REDUCING SIDE HOLE AND THAT OF SUCTION SUPPORT HOLE

摘要

PURPOSE: A handling apparatus is provided to reduce limitation of operation during receipt of electronic components, and achieve improved stability in supporting electronic components. CONSTITUTION: A handling apparatus comprises a first transfer drum(10A) and a second transfer drum(10B) for supporting chip type electronic components(70) on respective outer surfaces thereof, and transferring the electronic components; and a receiving unit for moving the electronic components supported at the first transfer drum to the second transfer drum. The first transfer drum and the second transfer drum have, at respective outer surfaces thereof, suction support holes for suction supporting the electronic components, pressure reducing side holes communicated to a pressure reducing source, and cavity buffer portions for interconnecting the suction support holes and the pressure reducing side holes. Each of the cavity buffer portion has a volume larger than that of the pressure reducing side hole and that of the suction support hole.