CURABLE RESIN COMPOSITION COMPRISING POLYMER CONTAINING EPOXY GROUPS, CATIONIC POLYMERIZABLE COMPOUND AND COMPOUND FOR IMPROVING ADHESION, PROTECTIVE FILM COMPRISING THE COMPOSITION AND FORMATION METHOD THEREOF

摘要

PURPOSE: Provided are a curable resin composition, a protective film comprising the composition which has satisfactory transparency, heat resistance, surface hardness and adhesion and an excellent load resistance under heating, and its formation method. CONSTITUTION: The curable resin composition comprises a polymer containing at least two epoxy groups; a cationic polymerizable compound other than the polymer; and at least one kind of compound selected from the group consisting of a thiazole, a thiazoline, a sulfenamide, a dithiocarbamate and a thiuram. Preferably the polymer containing at least two epoxy groups is a copolymer of an epoxy group-containing polymerizable unsaturated compound, a polymerizable unsaturated carboxylic acid and/or a polymerizable unsaturated polyvalent carboxylic anhydride, and a polymerizable unsaturated compound other than the two polymerizable unsaturated compounds.