首页> 外国专利> LABEL ATTACHING APPARATUS FOR SEMICONDUCTOR MODULE PRODUCTS MOUNTED ON BOTH-SIDED ATTACHING SUBSTRATE, METHOD FOR ESTABLISHING THE SAME, AND LABEL ATTACHING METHOD USING THE SAME FOR MINIMIZING ERRORS IN LABEL ATTACHING PROCESS BY PERFORMING AUTOMATION PROCESS USING BOTH-SIDED ATTACHING SUBSTRATE

LABEL ATTACHING APPARATUS FOR SEMICONDUCTOR MODULE PRODUCTS MOUNTED ON BOTH-SIDED ATTACHING SUBSTRATE, METHOD FOR ESTABLISHING THE SAME, AND LABEL ATTACHING METHOD USING THE SAME FOR MINIMIZING ERRORS IN LABEL ATTACHING PROCESS BY PERFORMING AUTOMATION PROCESS USING BOTH-SIDED ATTACHING SUBSTRATE

机译:安装在两个固定基板上的半导体模块产品的标签固定装置,建立相同方法的方法以及使用相同方法来最小化标签固定过程中的错误的方法,该方法是通过对两个步骤进行自动化处理来实现的

摘要

PURPOSE: A label attaching apparatus for semiconductor module products mounted on a both-sided attaching substrate, a method for establishing the same, and a label attaching method using the same are provided to minimize errors in a label attaching process by performing an automation process using the both-sided attaching substrate. CONSTITUTION: A first label attaching unit attaches a label to a semiconductor module product(500') loaded on a first side and/or a second side of a both-sided attaching substrate. A first inversion unit inverts the both-sided attaching substrate. A control unit controls operations of the first label attaching unit and the first inversion unit.
机译:用途:提供了一种用于安装在双面粘附基板上的半导体模块产品的标签粘附装置,一种用于建立该标签粘附装置的方法以及一种使用该标签粘附装置的标签粘附方法,以通过执行自动化过程来使标签粘附过程中的错误最小化双面附着基板。构成:第一标签粘贴单元将标签粘贴到装载在双面粘贴基板的第一面和/或第二面上的半导体模块产品(500')上。第一反转单元使双面附接基板反转。控制单元控制第一标签粘贴单元和第一反转单元的操作。

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号