APPARATUS AND METHOD FOR INSPECTING BONDING POSITION FOR ENHANCING RELIABILITY ACCORDING TO TEST OF BONDING POSITION BY DETERMINING BONDING STATE OF BONDING POSITION

摘要

Purpose: a device and a kind of method, for checking that a bonding position passes through the bond state for determining bonding position according to the test setting of bonding position into enhancing reliability. Construction: providing a method, for checking a bonding position. One of the beam irradiated from a laser beam source is calibrated in a stripe pattern (10). Beam is irradiated on the bonding position of a product (20). One deformation state of the beam irradiated on bonding position is taken pictures for (30). The image of input or the image signal of input determine the bond state of bonding position (40) compared with an established image or an established image signal. Bond state is determined (50).