POLYAMIDEIMIDE RESIN HAVING LOW ELASTICITY AND EXCELLENT FLEXIBILITY AND INSULATION PROPERTY, PREPARATION METHOD THEREOF, POLYAMIDEIMIDE RESIN COMPOSITION, COATING-FORMING MATERIAL AND ADHESIVE FOR ELECTRONIC COMPONENTS

摘要

PURPOSE: Provided is a polyamideimide resin, which has low elasticity and hygroscopic property and excellent flexibility, heat resistance, adhesion and electric insulation property, and thus is useful for coating-forming materials and adhesives for electronic components. CONSTITUTION: The polyamideimide resin comprises structural units represented by the following formula (1) and at least one of structural units represented by the following formula (2) or formula (3). When the structural unit of formula (1) is present in the number of k, that of formula (2) is presented in the number of m, and that of formula (3) is present in the number of n, 0 m/(k+m+n)-0.1. Additionally, the polyamideimide resin has a number average molecular weight of 2000-50000. In formulae 1, 2 and 3, each of Ar1 and Ar2 is an aromatic group that have a substituent; each of a, b and c is an integer of 0-100, with the proviso that a/b is 0/1-1/0, (a+b)/c is 1/0-0/1 and a+b+c=1-100; and d is an integer of 1-100.