PURPOSE: Provided is an epoxy resin composition for sealing a semiconductor device which shows excellent flame retardancy, reliance and formability without using a halogen-based flame retardant. CONSTITUTION: The epoxy resin composition comprises 3.5-15 wt% of a polyaromatic epoxy resin represented by the formula 1 as an epoxy resin; 2-10.5 wt% of a polyaromatic curing agent represented by the formula 2 as a curing agent; 0.5-5 wt% of zinc borate represented by 2ZnO3B2O33.5H2O and hydrotalcite represented by Mg4.5Al2(OH)13CO33.5H2O as a nonhalogenated flame retardant; 0.1-0.3 wt% of a curing accelerator; 0.05-1.5 wt% of a modified silicone oil; and 73-90 wt% of an inorganic filler, wherein n is an integer of 1-7. Preferably a biphenyl resin or an o-cresol novolac resin is further added as an epoxy resin in a ratio of 10:90 -80:20 by weight to the polyaromatic epoxy resin; and a xylene resin or a phenol novolac resin is added further as a curing agent in a ratio of 10:90 - 80:20 by weight to the polyaromatic curing agent.
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