METHOD FOR BONDING HEAT SINK OF LASER DIODE SEMICONDUCTOR AND LASER DIODE SEMICONDUCTOR TO QUICKLY TRANSFER AND RADIATE HEAT GENERATED FROM LASER DIODE TO METAL PLATE

摘要

The present invention is made of the laser diode semiconductor of heat sink welding method and the laser diode as semiconductor, more specifically, being formed heat sink with prominent is the preferred copper (Copper of thermal conductance on the top of metal plate) quic is emitted to from laser diode. KLY transfers heat to metal plate and is related to the present invention can heat (Suffi). ;As described above, the metal plate 10 in the whole surface of lens cover 40 is combined, the metal plate of radiator 11 and 10 is 41 one projections, and equipped with laser beam (irradiation) laser diode 20, and is fixed below. The close-up shot of laser diode photodiode 21 is provided on laser diode 20, metal plate 10, for detecting the transmitting light beam from 20 to laser diode 20, photodiode terminal pins 30 are for connecting or being grounded, 21 is prominent in laser diode semiconductor, and radiator 11 is by the fine copper (Copper of temperature-sensitive front end) laser diode (20) constitutes. T can be heated by metal plate 10, and radiator 11 is the metal plate 10 by welding to melt the welding material being made of alloy (11a), and the alloy is especially radiated from fixing piece. It can be realized by the semiconductor laser diode of setting.