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METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PREVENT ISOLATION LAYER IN FIELD REGION FROM BEING DAMAGED IN ETCHING GATE OXIDE LAYER FOR HIGH VOLTAGE DEVICE IN CORE DEVICE REGION
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PREVENT ISOLATION LAYER IN FIELD REGION FROM BEING DAMAGED IN ETCHING GATE OXIDE LAYER FOR HIGH VOLTAGE DEVICE IN CORE DEVICE REGION
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机译:一种制造半导体器件以防止场区高压层器件氧化膜层损坏而防止场区隔离层的方法
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摘要
A kind of purpose: method; for manufacturing semiconductor device it is arranged to that a separation layer is prevented to be compromised in terms of etching the gate oxide for the high voltage device in a core device region in a field region; it is used for a gate oxide of a core device by being formed, gate oxide is protected by a nitride layer, white layer and by forming a gate oxide for high voltage device. Construction: a separation layer (112) is formed in semi-conductive substrate (110), wherein the first region, is used to form a high voltage device and the secondth area for a logical device, is defined. One barrier layer (117) is for preventing oxidation to be formed in the secondth area. A gate oxide (120) for high voltage device is formed in the first region. Barrier layer in the second region is eliminated. A gate oxide (130) for logical device is formed in the secondth area by monoxide processing procedure.
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