首页> 外国专利> METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PREVENT ISOLATION LAYER IN FIELD REGION FROM BEING DAMAGED IN ETCHING GATE OXIDE LAYER FOR HIGH VOLTAGE DEVICE IN CORE DEVICE REGION

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PREVENT ISOLATION LAYER IN FIELD REGION FROM BEING DAMAGED IN ETCHING GATE OXIDE LAYER FOR HIGH VOLTAGE DEVICE IN CORE DEVICE REGION

机译:一种制造半导体器件以防止场区高压层器件氧化膜层损坏而防止场区隔离层的方法

摘要

A kind of purpose: method; for manufacturing semiconductor device it is arranged to that a separation layer is prevented to be compromised in terms of etching the gate oxide for the high voltage device in a core device region in a field region; it is used for a gate oxide of a core device by being formed, gate oxide is protected by a nitride layer, white layer and by forming a gate oxide for high voltage device. Construction: a separation layer (112) is formed in semi-conductive substrate (110), wherein the first region, is used to form a high voltage device and the secondth area for a logical device, is defined. One barrier layer (117) is for preventing oxidation to be formed in the secondth area. A gate oxide (120) for high voltage device is formed in the first region. Barrier layer in the second region is eliminated. A gate oxide (130) for logical device is formed in the secondth area by monoxide processing procedure.
机译:一种目的:方法;为了制造半导体器件,布置成在腐蚀场区域的核心器件区域中防止腐蚀高电压器件的栅极氧化物方面损害隔离层;它通过形成用于核心器件的栅极氧化物,通过氮化物层,白色层以及通过形成用于高压器件的栅极氧化物来保护栅极氧化物。构造:在半导体衬底(110)中形成隔离层(112),其中第一区域用于形成高压器件,而第二区域用于逻辑器件。一个阻挡层(117)用于防止在第二区域中形成氧化。在第一区域中形成用于高压器件的栅极氧化物(120)。消除了第二区域中的阻挡层。通过一氧化碳处理程序在第二区域中形成用于逻辑器件的栅极氧化物(130)。

著录项

  • 公开/公告号KR20050009617A

    专利类型

  • 公开/公告日2005-01-25

    原文格式PDF

  • 申请/专利权人 MAGNACHIP SEMICONDUCTOR LTD.;

    申请/专利号KR20030049417

  • 发明设计人 LEE JONG KON;

    申请日2003-07-18

  • 分类号H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:59

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