首页> 外国专利> DUAL BAND TEFLON LAYER-BUILT CHIP ANTENNA HAVING MULTI-BAND CHARACTERISTICS IN SINGLE ANTENNA BLOCK

DUAL BAND TEFLON LAYER-BUILT CHIP ANTENNA HAVING MULTI-BAND CHARACTERISTICS IN SINGLE ANTENNA BLOCK

机译:在单天线区具有多频带特性的双频带聚四氟乙烯层状芯片天线

摘要

PURPOSE: A dual band Teflon layer-built chip antenna is provided to permit the antenna to have multi-band characteristics in a single antenna block. CONSTITUTION: A dual band Teflon layer-built chip antenna comprises a chip body(200), a first helical conductor(201), a second helical conductor(202), a third helical conductor(205), and voltage supply terminals(203,204). The chip body is made of a Teflon dielectric material. The first helical conductor is formed in the chip body, and the second helical conductor intersects the first helical conductor in the chip body. The third helical conductor has an end connected to the first helical conductor in the chip body. The first helical conductor and the second helical conductor are separated from each other. The first helical conductor and the second helical conductor have ends protruded toward a surface of the chip body so as to form the voltage supply terminals for applying power to the first helical conductor and the second helical conductor.
机译:目的:提供双频带特氟龙层构建的芯片天线,以允许该天线在单个天线模块中具有多频带特性。组成:双频带特氟龙层构建的芯片天线,包括芯片主体(200),第一螺旋导体(201),第二螺旋导体(202),第三螺旋导体(205)和供电端子(203,204) 。芯片主体由特氟龙介电材料制成。第一螺旋形导体形成在芯片主体中,第二螺旋形导体与芯片主体中的第一螺旋形导体相交。第三螺旋导体的一端连接到芯片主体中的第一螺旋导体。第一螺旋导体和第二螺旋导体彼此分开。第一螺旋导体和第二螺旋导体的端部朝向芯片主体的表面突出,从而形成用于向第一螺旋导体和第二螺旋导体施加电力的电压供给端子。

著录项

  • 公开/公告号KR20050012557A

    专利类型

  • 公开/公告日2005-02-02

    原文格式PDF

  • 申请/专利权人 SEGYE TELECOM CO. LTD.;

    申请/专利号KR20030051550

  • 发明设计人 YURY TERESHCHENKO;YUN JONG CHEL;

    申请日2003-07-25

  • 分类号H01Q23/00;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:52

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