首页> 外国专利> METHOD OF SELECTING PHOTOMASK BLANK SUBSTRATE FOR FORMING PHOTOMASK USED FOR EXPOSING PATTERNS HAVING REDUCED MINIMUM FEATURE SIZE

METHOD OF SELECTING PHOTOMASK BLANK SUBSTRATE FOR FORMING PHOTOMASK USED FOR EXPOSING PATTERNS HAVING REDUCED MINIMUM FEATURE SIZE

机译:选择用于形成具有减小的最小特征尺寸的图案的光掩膜的光掩膜基质的方法

摘要

PURPOSE: A method of selecting a photomask blank substrate is provided to form a photomask used for exposing patterns having a reduced minimum feature size to high accuracy on a wafer substrate. CONSTITUTION: One or more layer including at least a masking layer or a phase shift layer is deposited on a top surface(1) of a photomask blank substrate to form a photomask blank. The deposited layer is patterned to form a photomask. The photomask is mounted in an exposure tool. A method of selecting the photomask blank substrate includes a simulating process, a determining process, and a selecting process. The simulating process is performed to simulate a change of shape on the top surface of the substrate before the deposition process when the photomask is mounted in the exposure tool. The determining process is performed to determine the shape on the top surface of the substrate before the change of shape when the photomask is mounted in the exposure tool. The selecting process is performed to select a substrate having the shape on the top surface before the deposition process.
机译:目的:提供一种选择光掩模坯料基板的方法,以形成用于将具有减小的最小特征尺寸的图案高精度地曝光到晶片基板上的光掩模。组成:一层或多层包括至少一个掩膜层或相移层沉积在光掩模坯基板的顶表面(1)上,以形成光掩模坯。对沉积的层进行构图以形成光掩模。光掩模安装在曝光工具中。选择光掩模坯料基板的方法包括模拟过程,确定过程和选择过程。当将光掩模安装在曝光工具中时,执行模拟过程以模拟在沉积过程之前基板的顶表面上的形状变化。当将光掩模安装在曝光工具中时,执行确定过程以在形状改变之前确定基板的顶表面上的形状。在沉积工艺之前,执行选择工艺以选择在顶表面上具有形状的基板。

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