RADIATION SENSITIVE RESIN COMPOSITION COMPRISING COPOLYMER OF UNSATURATED CARBOXYLIC ACID COMPOUND AND/OR ITS ANHYDRIDE, ALICYCLIC EPOXY FRAMEWORK-CONTAINING UNSATURATED COMPOUND AND UNSATURATED COMPOUND OTHER THAN TWO COMPOUNDS, AND 1,2-NAPHTHOQUINONEDIAZIDESULFONATE COMPOUND, INTERLAYERED INSULATING LAYER AND MICROLENS USING THE COMPOSITION, AND THEIR PREPARATION METHODS

摘要

PURPOSE: Provided are a radiation sensitive resin composition which shows high radiation sensitivity, has a development margin capable of forming a satisfactory pattern profile even if it exceeds an optimum development time and can form easily a pattern-type thin film having good adhesion, an interlayered insulating layer using the composition which has high heat resistance and high transmittance, its preparation method, a microlens using the composition which shows high transmittance and satisfactory melt profile, and its preparation method. CONSTITUTION: The radiation sensitive resin composition comprises a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an unsaturated compound having an alicyclic epoxy framework represented by the formulas, and (a3) an unsaturated compound other than (a1) and (a2); and a 1,2-naphthoquinonediazidesulfonate compound. Preferably the component (a3) comprises an unsaturated compound having a tricyclo£5.2.1.0¬2,6|decan-8-yl framework and other unsaturated compounds. Preferably the ratio of the copolymer and the 1,2-naphthoquinonediazidesulfonate compound is 100 : 5-100 by weight.