首页> 外国专利> RADIATING STRUCTURE OF A MOBILE COMMUNICATION TERMINAL, ESPECIALLY IN CONNECTION WITH EMITTING HEAT GENERATED FROM A POWER AMPLIFIER MODULE BY USING A RADIATING MATERIAL

RADIATING STRUCTURE OF A MOBILE COMMUNICATION TERMINAL, ESPECIALLY IN CONNECTION WITH EMITTING HEAT GENERATED FROM A POWER AMPLIFIER MODULE BY USING A RADIATING MATERIAL

机译:移动通信终端的辐射结构,特别是与使用辐射材料从功率放大器模块产生的热量有关的辐射结构

摘要

PURPOSE: A radiating structure of a mobile communication terminal is provided to separate a circuit board from a power amplifier module, and to emit heat generated from the power amplifier module outside a terminal by using a radiating material, thereby quickly emitting the generated heat. CONSTITUTION: A power amplifier module(11) is attached to a position separated from a circuit board(12) to the maximum. A signal line is connected between the power amplifier module(11) and the circuit board(12) by using FPCBs(13) in order to transceive a signal with the circuit board(12). A radiating material(14) is attached to be located in an upper section of a battery(15) while being directly contacted with external air, to easily emit heat generated from the power amplifier module(11).
机译:用途:提供一种移动通信终端的散热结构,以将电路板与功率放大器模块分离,并通过使用散热材料将功率放大器模块产生的热量散发到终端外部,从而迅速散发产生的热量。组成:功率放大器模块(11)固定在与电路板(12)分开的最大位置。信号线通过使用FPCB(13)连接在功率放大器模块(11)和电路板(12)之间,以便与电路板(12)收发信号。辐射材料(14)被附接以位于电池(15)的上部中,同时直接与外部空气接触,以容易地散发从功率放大器模块(11)产生的热量。

著录项

  • 公开/公告号KR20050019700A

    专利类型

  • 公开/公告日2005-03-03

    原文格式PDF

  • 申请/专利权人 PANTECH CO. LTD.;

    申请/专利号KR20030057812

  • 发明设计人 JUNG KAE YOUNG;

    申请日2003-08-21

  • 分类号H04B1/38;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:45

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