SURFACE TREATED COPPER FOIL FROM WHICH BLACK PARTICLES ARE NOT STAINED SO THAT IT IS PROPERLY USED IN SHIELD MATERIAL BY COMPRISING DARK BLACK DULL PLATING LAYER

摘要

PURPOSE: To provide a black dull surface treated copper foil which is excellent in etching property, oxidation resistance, heat resistance and chemical resistance and has high peel strength, from which black particles are not stained, and which improves productivity and accomplishes a fixed surface roughness according to formation of submicroscopic nodule by one plating layer without performing of roughening process and barrier layer forming process. CONSTITUTION: The surface treated copper foil comprises a copper or copper alloy substrate(10); and a plating layer(30) formed of Cu-Co-Fe-Ni on one side surface(20) or both side surfaces(20,21) of the substrate(10), wherein the plating layer is a plating layer having thickness of 1 m or less containing 1 to 4 mg/m¬2 of Cu, 1,000 to 2,000 mg/m¬2 of Co, 300 to 600 mg/m¬2 of Fe and 7 to 15 mg/m¬2 of Ni, wherein the plating layer contains 2 to 3 mg/m¬2 of Cu, 1,100 to 1,500 mg/m¬2 of Co, 400 to 550 mg/m¬2 of Fe and 10 to 13 mg/m¬2 of Ni, and wherein the plating layer comprises a nodule having an average cross-sectional width of about 0.1 to 2 m and an average height of about 0.1 to 1 m.