MOLD DEVICE FOR COMPRESSING AND INJECTION-MOLDING COMPOSITE SYNTHETIC RESIN AT HIGH TEMPERATURE BY HEATING DIRECTLY THE RESIN WITH A HOT PLATE OR PASSING THE RESIN THROUGH A CONTINUOUS FURNACE

摘要

PURPOSE: A die device for compressing and injection-molding composite synthetic resin is provided to compress and mold the resin at high temperature by directly or indirectly heating the resin with a hot plate attached to a mold and a continuous furnace and to improve functionally the environment and production efficiency. CONSTITUTION: A die device for compressing and injection-molding composite synthetic resin is composed of a mold upper plate having a core, an upper plate core(1), a mold middle plate, and a lower mold. The mold upper plate and the upper plate core are produced separately. A contact portion of the mold upper plate and the upper plate core and the lower mold core are separately produced. Some of the resin is discharged when the resin is melted and compressed in a contact portion of the upper plate and the core and a lower contact portion of the lower plate and the core and accordingly, the density of products is increased precisely. The mold middle plate and the lower mold plate are fixed and combined to each other. The mold upper plate and the upper plate core are inserted accurately into the mold middle plate with keeping a gap in compressing the resin. The lower mold core pushes up a lower mold core by an injector bar(9) to extract products in cooling the resin.