The present invention relates to a developing method of a photolithography step for developing the photoresist on the semiconductor substrate subjected to the exposure process.; The developing method of a photolithography process according to the invention To this end, the step of rotating the substrate subjected to the coating and exposure process of (a) a photoresist; (B) the step of spraying the developing solution on the substrate in a state in which the substrate is rotated; And (c) allowed to stand for a certain period of time the substrate to a no-load condition; (D) injecting the cleaning solution with the substrate in the no-load condition, primarily for a certain period of time; (E) the step of rotating for a predetermined time to the substrate injecting a cleaning solution to the substrate secondarily; And (f) a step of drying a cleaning solution for a predetermined time while rotating the substrate.
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