首页> 外国专利> COOLDOWN LIFT ASSEMBLY OF COOLDOWN CHAMBER

COOLDOWN LIFT ASSEMBLY OF COOLDOWN CHAMBER

机译:冷却室的冷却塔组件

摘要

The invention rapidly cool the cool-down chamber at a heat treatment system down lift assembler brie the bar, which is to place the wafer and install a new lift pins assembler debris using a bearing structure connecting the up / down cylinder and the lift pin and the guide pin Cool down will lift debris on the assembler of the cool-down chamber capable.; The present invention to achieve this by the lift pins lift shaft by reciprocating movement of the up / down cylinder moves in the vertical direction in the cooldown chamber to let the lift plate rises a lift pin or the falling down, each of the vertical of the lift plate and that the pin through the respective connecting means is provided for each lift pin, each guide pin is provided through each connection means to the outside of these lift pins to its features.
机译:本发明在热处理系统中向下冷却组装室快速冷却冷却室,该向下组装器使棒条通过使用连接上/下缸体和升降销的轴承结构放置晶片并安装新的升降销组装器碎片。导销冷却将抬起能够冷却的装配室上的碎屑。本发明通过使升降销升降轴通过上下汽缸的往复运动在冷却室中沿竖直方向运动来实现该目的,以使升降板上升或下降,升降销的每个垂直对于每个提升销,通过每个连接销提供通过相应的连接装置的销,通过每个连接装置将每个导向销提供给这些提升销的外部。

著录项

  • 公开/公告号KR20050069672A

    专利类型

  • 公开/公告日2005-07-05

    原文格式PDF

  • 申请/专利权人 DONGBUANAM SEMICONDUCTOR INC.;

    申请/专利号KR20030101975

  • 发明设计人 KIM TAE HUN;

    申请日2003-12-31

  • 分类号H01L21/324;

  • 国家 KR

  • 入库时间 2022-08-21 22:04:59

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