首页> 外国专利> METHOD FOR DEPOSITING RUO2 COMPRISING ECR PLASMA PRETREATMENT ON THE SURFACE OF TIN SURFACE

METHOD FOR DEPOSITING RUO2 COMPRISING ECR PLASMA PRETREATMENT ON THE SURFACE OF TIN SURFACE

机译:在锡表面上沉积含ECR等离子体的RUO2的方法

摘要

The present invention relates to a RuO 2 deposition methods, including ECR plasma pretreatment of the surface of the TiN film, specifically, RuO 2 deposition by step, the method and the MOCVD method on the TiN film to a chemical pre-treatment the TiN film coated film TiN on the Si wafer in the deposition method of the RuO 2 consisting of steps, the evaporation method of RuO 2, characterized in that it comprises a step of cleaning a TiN film by performing the chemical pre-treatment stage with hydrogen or argon ECR plasma pre-treatment in between the deposition steps of the RuO 2 It relates.; Deposition of RuO 2 by a MOCVD method of the invention is the evaporation of RuO 2 may by carried out with ECR plasma pretreatment on the surface of the TiN film, removing the oxygen and nitrogen atoms in the TiN film surface, through this removal RuO 2 nuclear It can further improve the production.
机译:本发明涉及RuO 2 的沉积方法,包括对TiN膜表面进行ECR等离子体预处理,具体地,涉及RuO 2 的分步沉积,方法和MOCVD。方法在RuO 2 的沉积方法中对Si晶片上的TiN膜涂覆的膜TiN进行化学预处理,该方法包括以下步骤:RuO 2的蒸发方法, ,其特征在于它包括以下步骤:在RuO 2 的沉积步骤之间,通过氢气或氩气ECR等离子体预处理执行化学预处理阶段,从而清洁TiN膜。相关。通过本发明的MOCVD方法沉积RuO 2 是因为可以通过在TiN膜的表面上进行ECR等离子体预处理来进行RuO 2 的蒸发,从而除去氧TiN膜表面的氮原子和氮原子,通过这种去除RuO 2 核能进一步提高产量。

著录项

  • 公开/公告号KR20050092504A

    专利类型

  • 公开/公告日2005-09-22

    原文格式PDF

  • 申请/专利权人 INHA-INDUSTRY PARTNERSHIP INSTITUTE;

    申请/专利号KR20040017569

  • 发明设计人 LEE CHONG MU;EOM TAE JONG;

    申请日2004-03-16

  • 分类号H01L21/205;

  • 国家 KR

  • 入库时间 2022-08-21 22:04:33

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