PLATE-LIKE WORK POLISHING APPARATUS AND METHOD OF POLISHING PLATE-LIKE WORK

摘要

A plate-like work polishing apparatus for polishing a thin plate-like work such as a printed circuit board material by buff rollers, comprising a guide member guiding the plate- like work passed through a clearance between the buff rollers and backup rollers to carrying rollers, wherein the plate-like work is prevented from being broken due to the bending of the thin plate-like work when the surfaces thereof are polished by the buff rollers by stopping the rotation of the buff rollers during the carrying of the plate-like sheet or reversely rotating the buff rollers. Also, the apparatus comprises a shielding member preventing water splash including swarf sludge produced in a polishing roller assembly from being splashed at least in a work carrying direction and a feed passage feeding water splashed on the shielding member to the outside of the apparatus. Thus, the occurrence of recessed scratches and dents can be prevented, and the cause of a trouble with electrical connection performed through the interlayer holes of the printed circuit board can be eliminated.