APPARATUS FOR CONTROLLING PLATING LIQUID IN PLATING TANK

摘要

PURPOSE: A system and a method for controlling plating solution of plating tank are provided to form electrode to a more uniformed thickness on wafer and prevent overflow or exhaustion of the plating solution and danger of electric leakage or fire by controlling level and temperature of the plating solution stored in the plating tank to set values. CONSTITUTION: The method comprises first step (S31) of sensing level, pH and temperature of the plating solution of the plating tank; second step (S32,S33) of emergency stopping plating operation if level of the plating solution is the same as or less than an emergency stopping level, and alarming the emergency stop; third step (S34) of controlling operation of heater according to an error between sensed temperature values and a set temperature value; fourth step (S35) of controlling supply of the plating solution according to an error between sensed level values of the plating solution and a set level value; fifth step (S36) of controlling supply of pure solution according to an error between sensed pH values and a set pH value; sixth step (S37) of controlling supply of the plating solution according to plating time; and seventh step (S38) of proceeding the first step before selecting a finish mode, and finish control of the plating solution if the finish mode is selected.