首页>
外国专利>
Power distribution board printing non-conductive through hole surface treatment process for reducing the formation of bubbles in a printed circuit board
Power distribution board printing non-conductive through hole surface treatment process for reducing the formation of bubbles in a printed circuit board
展开▼
机译:配电板印刷非导电通孔表面处理工艺,用于减少印刷电路板中气泡的形成
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.
展开▼