首页> 外国专利> METHOD FOR PRODUCING STRIPPING FILM FOR PRODUCING THIN FILM, METHOD FOR PRODUCING THIN FILM FOR ELECTRONIC COMPONENT, AND STRIPPING FILM FOR PRODUCING THIN FILM

METHOD FOR PRODUCING STRIPPING FILM FOR PRODUCING THIN FILM, METHOD FOR PRODUCING THIN FILM FOR ELECTRONIC COMPONENT, AND STRIPPING FILM FOR PRODUCING THIN FILM

机译:用于制造薄膜的剥离膜的制造方法,用于电子部件的薄膜的制造方法,以及用于薄膜的剥离膜

摘要

Method of manufacturing a thin film for producing a release film according to the present invention, the base film (2) After applying the coating liquid (3a) comprising a silicone resin, the coating liquid (3a) by drying the release layer (3 by a silicon resin ) to a manufacturing method for manufacturing a thin film for producing a release film (1) for electronic components wrapped around the base film 2 is formed, and the release layer 3 is formed on the base film (2) into a roll, the base film ( 2) less than the thickness of more than 5㎛ 30㎛, while applying a release layer (3) tension in the range of 3 Newton or more than 17 Newtons per width 100㎜ of the base film 2 is formed is wound the base film (2) . As a result, while preventing elongation of the wound winding or unwinding the base film (2) in the state, it is possible to secure the flatness of the surface of the release layer (3).
机译:根据本发明的制造用于制备脱模膜的薄膜的方法,将基膜(2)涂布在包含有机硅树脂的涂布液(3a)之后,通过将脱模层(3)干燥来涂布该涂布液(3a)。形成用于制造薄膜的制造方法的薄膜的制造方法,该薄膜用于生产包裹在基膜2周围的电子部件用脱模膜(1),并且脱模层3在基膜(2)上形成为卷状然后,形成厚度小于5㎛30㎛的基膜(2),同时在基膜2的每100㎜宽度施加3牛顿或大于17牛顿的范围内施加剥离层(3)。缠绕基膜(2)。结果,在该状态下防止伸长的缠绕或展开基膜(2)的同时,可以确保脱模层(3)的表面的平坦度。

著录项

  • 公开/公告号KR100510336B1

    专利类型

  • 公开/公告日2005-08-25

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20037010735

  • 申请日2003-08-14

  • 分类号B28B1/30;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:30

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