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METHOD FOR PRODUCING STRIPPING FILM FOR PRODUCING THIN FILM, METHOD FOR PRODUCING THIN FILM FOR ELECTRONIC COMPONENT, AND STRIPPING FILM FOR PRODUCING THIN FILM
METHOD FOR PRODUCING STRIPPING FILM FOR PRODUCING THIN FILM, METHOD FOR PRODUCING THIN FILM FOR ELECTRONIC COMPONENT, AND STRIPPING FILM FOR PRODUCING THIN FILM
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机译:用于制造薄膜的剥离膜的制造方法,用于电子部件的薄膜的制造方法,以及用于薄膜的剥离膜
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摘要
Method of manufacturing a thin film for producing a release film according to the present invention, the base film (2) After applying the coating liquid (3a) comprising a silicone resin, the coating liquid (3a) by drying the release layer (3 by a silicon resin ) to a manufacturing method for manufacturing a thin film for producing a release film (1) for electronic components wrapped around the base film 2 is formed, and the release layer 3 is formed on the base film (2) into a roll, the base film ( 2) less than the thickness of more than 5㎛ 30㎛, while applying a release layer (3) tension in the range of 3 Newton or more than 17 Newtons per width 100㎜ of the base film 2 is formed is wound the base film (2) . As a result, while preventing elongation of the wound winding or unwinding the base film (2) in the state, it is possible to secure the flatness of the surface of the release layer (3).
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