首页> 外国专利> Process for the plasma-activated high rate vaporization of a large surface substrate in a vacuum comprises producing a magnetic field diverging in the direction of the substrate, and further processing

Process for the plasma-activated high rate vaporization of a large surface substrate in a vacuum comprises producing a magnetic field diverging in the direction of the substrate, and further processing

机译:在真空中对大表面基材进行等离子活化的高速率汽化的方法包括产生在基材方向上发散的磁场,并进行进一步处理

摘要

Process for the plasma-activated high rate vaporization of a large surface substrate in a vacuum comprises producing a magnetic field (14) diverging in the direction of the substrate (1) between a vaporization unit and the substrate, producing a high energy plasma between the vaporization unit (3) and the substrate, vaporizing a vaporizing material using a high energetic electron beam having energies of 10-100 keV, partially ionizing the vapor with the plasma, and accelerating the ions in the direction of the substrate in the region of the magnetic field. An independent claim is also included for a vacuum coating installation for carrying out the process.
机译:在真空中对大表面基材进行等离子体活化的高速率汽化的方法包括:在汽化单元和基材之间产生在基材(1)方向上发散的磁场(14),在汽化单元和基材之间产生高能等离子体。蒸发单元(3)和衬底,使用能量为10-100 keV的高能电子束蒸发蒸发材料,用等离子体使蒸汽部分电离,并在衬底区域中沿衬底方向加速离子。磁场。还包括用于执行该工艺的真空镀膜设备的独立权利要求。

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