Thermoplastic molding compositions comprise a polyamide with a piperidine compound-derived end-group and a copolymer with a functional group reactive with the polyamide end-group

摘要

A thermoplastic molding composition comprises (a) a polyamide containing an end-group derived from a specified piperidine compound; and (b) a specified copolymer containing a functional group which can react with the end-group in (a). A thermoplastic molding composition comprises (a) a polyamide containing an end-group derived from a piperidine compound of formula (I); and (b) a copolymer which is (i) a rubber-free statistical copolymer containing a styrene, a monomer with a group reacting with the end-group of polyamide (a) and a monomer with no groups reactive with (a); (ii) a 95-99.5/0.5-5 Y/X block copolymer with Y being a mixture of a styrene with an ethylenically unsaturated ester or with a monomer other than maleic anhydride and X being an alternating structure of a styrene and an acid and/or anhydride comonomer; or (iii) a rubber-free statistical copolymer of methyl methacrylate, an acid and/or anhydride comonomer and optionally also a (meth)acrylic ester. [Image] R : an amide-forming group R7 or a functional group containing 1-4 same or different amide-forming groups R7; R1H, 1-20C alkyl, cycloalkyl, benzyl or OR6 with R6 = H, 1-20C alkyl, cycloalkyl or benzyl; R2 - R51-10C alkyl; R7-(NHR9), carboxyl or a carboxylic acid derivative; and R9H, 1-8C alkyl, 3-10C cycloalkyl or 2-20C alkylene.