Packaging container for power semiconducting modules has cover surface with support(s) that narrows as it extends into molded body and into opening in module to prevent contact between module and covering surface

摘要

The device has at least one molded body (100a,100b) with a wall and a preferably fully closed cover surface (120a,b), supporting edges (112) or surfaces, whereby the module rests on wall sections and contact with the cover surface is prevented by the supporting edges or surfaces. The cover surface has at least one support (122) that narrows as it extends into the molded body and into an opening in the module (200) to prevent contact between the module and covering surface.