首页> 外国专利> Process for producing deep p regions in silicon irradiates n substrate with high energy particles such that it is converted into a p region of required depth after a given time and temperature

Process for producing deep p regions in silicon irradiates n substrate with high energy particles such that it is converted into a p region of required depth after a given time and temperature

机译:在硅中产生深p区域的方法用高能粒子辐照n基板,以便在给定的时间和温度下将其转换为所需深度的p区域

摘要

A process for producing deep p-regions in silicon comprises irradiating n-substrate or n-epitaxial sections of the semiconductor element being made with high-energy particles of such energy that, after a given time and heating temperature the n-region is converted to a p-region to the required depth.
机译:在硅中产生深p区域的工艺包括用高能粒子辐照制成的半导体元件的n衬底或n外延部分,这种高能粒子在给定的时间和加热温度后将n区域转换为一个p区域到所需深度。

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