首页> 外国专利> Method for enveloping electrical components with ceramic insulating material for components to withstand operational temperature of up to 300 degrees C, e.g. resistors, using mould forming intermediate space between element to be protected

Method for enveloping electrical components with ceramic insulating material for components to withstand operational temperature of up to 300 degrees C, e.g. resistors, using mould forming intermediate space between element to be protected

机译:用陶瓷绝缘材料包裹电气部件的方法,使部件能够承受最高300摄氏度的工作温度,例如电阻,使用模具在要保护的元件之间形成中间空间

摘要

Method uses ceramic paste and component enveloping is carried out in mould. Intermediate space between component elements, to be protected, and inner wall of mould is so chosen that resulting thickness of paste thickness gives required electric and mechanical protection. Preferably mould is of water absorbing material, e.g. gypsum, or porous plastics and may have through bushings. Electric contact pins are to be sealed during paste filling to prevent soiling of pins.
机译:方法使用陶瓷糊料,并在模具中进行组件包封。选择要保护的组件元件和模具内壁之间的中间空间,以使所得到的焊膏厚度达到所需的电气和机械保护。优选地,模具由吸水材料制成,例如,吸水材料。石膏或多孔塑料,可能具有通孔套管。填充糊剂期间应密封电触针,以防止弄脏针。

著录项

  • 公开/公告号DE102004005909A1

    专利类型

  • 公开/公告日2005-08-25

    原文格式PDF

  • 申请/专利权人 RIO GMBH;

    申请/专利号DE20041005909

  • 发明设计人 GUENTHER ANDREAS;

    申请日2004-02-05

  • 分类号H01L21/56;H01L23/28;H01C1/034;H01C17/02;H01G2/10;H01G13/00;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:55

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