Cooling plate stack manufacturing method for e.g. laser diode, involves subjecting stack to hot isostatic pressing treatment with inert gas pressure of specific range, at curing temperature that is lower than solder melting temperature

摘要

The method involves applying a solder to copper plates (1-5), and joining the plates by heating them up to a solder melting temperature to form plate stack. The stack is cooled to a temperature less than the melting temperature. The stack is subjected to hot isostatic pressing (HIP) treatment in an inert gas atmosphere with gas pressure ranging between 200 and 2000 bar, at a curing temperature that is lower than melting temperature. The curing temperature ranges from 390 to 1052 degree Celsius.