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Laminar and abrasive machining device for e.g. crystalline silicon wafer, has supporting device with surface bearing and bearing supports supporting rear side of work disk which is pressed against carrier`s front with work piece
Laminar and abrasive machining device for e.g. crystalline silicon wafer, has supporting device with surface bearing and bearing supports supporting rear side of work disk which is pressed against carrier`s front with work piece
The device has a work piece carrier (2) supported by a press stamp that is supported in such a way that the carrier and a work piece on the carrier are pressed against the front side of a work disk (5). A supporting device has a surface bearing (6) and bearing supports (8) supporting the rear side of the work disk which is pressed against on the front of the carriers with the work piece.
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