Semiconductor component (SC) for operating a cooling device has a sliding bow and a chip carrier or semiconductor chip for making thermal contact in sections with a medium surrounding the SC

摘要

A semiconductor component (1) has a casing (7), a semiconductor chip (2), a connection leg (3a) protruding from the casing and a sliding bow (4). The semiconductor chip and the connection leg interlink electrically by means of the sliding bow so as to be conductive. The sliding bow maintains thermal contact with a heat sink (5) protruding from the casing in sections.