Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block

摘要

The optoelectronic building block (24) acts as a transmitter/receiver unit. Manufacture of the optoelectronic assembly involves a first gripper lowering an optical deflector block (11) into a cutout in an optical conductor plate (18) with a light guide (19). The optical deflector block is bedded in a transparent UV-hardening adhesive (22). A second gripper lowers the optoelectronic building block onto electrodes (15) with an adhesive (17) on metalized layers (14) on top of the defector block. The electrodes are surrounded by a transparent filler layer (28).