Solder bump manufacturing method e.g. for use in wafer level package fabrication, involves forming two reinforcing protrusions upwardly extending from chip and mounting substrate, respectively, that are embedded in solder material

摘要

Two reinforcing protrusions (311,311) are formed extending upwardly from contact pad (102) of semiconductor chip (101), and from ball pad (108) of mounting substrate (109), respectively. The two protrusions are embedded in a solder material (105). Independent claims are also included for the following: (1) solder bump structure; (2) method of forming solder bump connection between semiconductor chip and mounting substrate; and (3) semiconductor device.