Semiconductor component e.g. X-ray detector, identifying device, has identification unit with component information identifying component through packages using acoustic and scanning signals that are sent to readout device

摘要

The device has an identification unit (14) arranged in an area of a component (2) within external packages (12, 19). The unit includes component information (15) for identifying the component through the external packages using acoustic signals (17) and scanning signals. The unit transmits signals representing the information to a readout device (16) that is present outside the packages. An independent claim is also included for a method of identifying a component surrounded by a non-transparent outer package.