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measurement of mikrogalvanisch manufactured components by schnittbauteile on lackstege

机译:力不足时用金属丝对米克罗瓦尔瓦尼奇制造的部件进行测量

摘要

A method for measuring microgalvanically produced components having a three-dimensional, depth-lithographically produced structure, which provides a single- or multilayer component which is constructed using galvanic metal deposition, the metal being deposited around a structure of photoresist defining the desired orifice contour of the component; in the process, a photoresist region, which selectively interrupts the structure of the component to be manufactured, being incorporated during the microgalvanic production; at least the interrupting photoresist region being dissolved out of the interrupted component; and a contactless measuring of the orifice structure of the interrupted component being undertaken in the region of a previously existing resist edge of the photoresist region using a measuring device.
机译:一种用于测量具有三维深度光刻生产结构的微电镀生产部件的方法,该方法提供了使用电镀金属沉积构造的单层或多层部件,金属沉积在光刻胶结构周围,从而定义了所需的孔口轮廓组件;在此过程中,在微电流生产过程中加入了光刻胶区域,该区域选择性地打断了要制造的组件的结构。至少将所述中断光致抗蚀剂区域从所述中断成分中溶解掉;使用测量装置在光致抗蚀剂区域的先前存在的抗蚀剂边缘的区域中进行中断组件的孔结构的非接触式测量。

著录项

  • 公开/公告号DE50202720D1

    专利类型

  • 公开/公告日2005-05-12

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号DE20025002720T

  • 发明设计人 DANTES GUENTER;

    申请日2002-04-09

  • 分类号G01B11/00;C25D1/00;G03F7/00;F02M61/00;B05B1/00;

  • 国家 DE

  • 入库时间 2022-08-21 21:59:55

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