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method and device for polishing halbleiterscheiben
method and device for polishing halbleiterscheiben
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机译:于对哈尔滨啤酒蜡进行抛光的方法和装置
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摘要
Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser (42) that dispenses slurry (44) from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser (42) and wafer to redistribute the slurry (44) also improves the slurry distribution. IMAGE
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