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Method of manufacturing a device in a thin layer produced on a substrate, in particular, a sensor, as well as a device in a thin layer

机译:制造在基板上制造的薄层器件的方法,特别是传感器,以及薄层器件

摘要

Method of manufacturing a device in a thin layer formed on a substrate (1 a, 26, 48), in particular, a sensor (20), with a system of functional layers (2) which are relatively thin formed of several layers separated as a whole constituting an electrical portion essential functional of the device to a thin layer to the electrical structures (41 - 44), and a metallization (4) is applied to the system of functional layers to the contacts (21, 22) and the conductive paths (4a, 23). The system of functional layers (2) and the metallization (4) are made successively without in the interval to be brought into contact with the ambient atmosphere, then it carries out the structure of the layers.
机译:具有在基板(1a,26、48)上形成的薄层中的器件的制造方法,特别是在传感器(20)上,该器件具有相对薄的功能层(2)的系统,该功能层(2)由几层分开形成构成装置的基本功能的电气部分的整体到电气结构(41-44)的薄层,金属化(4)应用于功能层系统的触点(21、22)和导电层路径(4a,23)。连续地制造功能层(2)和金属化层(4)的系统,而没有间隔使其与周围大气接触,然后执行层的结构。

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