Photolithographic process for microelectromechanical system fabrication, involves developing photosensitive resin layer to obtain patterns with inclined flanks relative to normal to substrates principal plane based on deviation angle

摘要

The process involves insolating a photosensitive resin layer (601) through a mask (603) by a light ray beam (602) with a principal direction. The beam traverses an optical system (606) deviating the direction by an angle of preset deviation. The mask is withdrawn. The layer is developed to obtain patterns with inclined flanks with respect to a normal to a principal plane of a substrate (600) according to the deviation angle. The beam is deviated such that the direction has an angle of incidence on the mask relative to a normal to a principal plane of a substrate (600) when the beam penetrates through the mask. An independent claim is also included for a device for producing inclined patterns by photolithography.