首页> 外国专利> GRINDING PROCESSING METHOD AND GRINDING PROCESSING DEVICE OF FORMING DIE OF MICRO LENS ARRAY

GRINDING PROCESSING METHOD AND GRINDING PROCESSING DEVICE OF FORMING DIE OF MICRO LENS ARRAY

机译:微透镜阵列成形模的磨削加工方法及磨削加工装置

摘要

PROBLEM TO BE SOLVED: To highly accurately and uniformly grind and process a recessed part of a spherical shape having a predetermined radius of curvature and surface accuracy on a molding surface.;SOLUTION: This grinding processing device has a main spindle 7 for installing a work, a grinding spindle 9 slantingly arrangeable to the main spindle 7, a grinding wheel 13 installed on the grinding spindle 9, a grinding spindle holder 12 for substantially integrally revolving and moving the grinding wheel 13 with the work in a state of setting a distance between the main spindle 7 and the processing center of the work substantially constant by pushing the grinding wheel 13 against the work, and a sensor 35 for measuring dimensional accuracy of the processed recessed part of the spherical shape. An inclination of the grinding spindle 9 is corrected by feeding back a measuring result by the sensor 35 to a rotary table 10 via a control part 36.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:为了在成型面上高精度且均匀地研磨并加工具有预定曲率半径和表面精度的球形凹部。解决方案:该研磨处理装置具有主轴7,用于安装工件。磨削主轴9,可倾斜地设置在主轴7上的磨削主轴9,安装在该磨削主轴9上的磨削轮13,以及使磨削滑轮13在工件与工件之间保持一定距离的状态下大致一体地旋转并移动的磨削主轴支架12。主轴7和工件的加工中心通过将砂轮13推向工件而基本恒定,并且传感器35用于测量球形的加工后的凹部的尺寸精度。通过将传感器35的测量结果通过控制部件36反馈到旋转工作台10来校正磨削主轴9的倾斜。版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2006289566A

    专利类型

  • 公开/公告日2006-10-26

    原文格式PDF

  • 申请/专利权人 OLYMPUS CORP;

    申请/专利号JP20050115250

  • 发明设计人 CHIAKI SHUNJI;

    申请日2005-04-13

  • 分类号B24B13/00;

  • 国家 JP

  • 入库时间 2022-08-21 21:57:01

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号