CUTTING OR GRINDING PROCESSING OF HIGHLY BRITTLE MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a cutting or grinding processing of a highly brittle material which can suppress the foaming during the processing and restrain the chips generated upon processing the highly brittle material from adhering to the material being worked.;SOLUTION: The cutting or grinding processing of highly brittle materials uses an agent for processing highly brittle materials, which comprises 1-10,000 ppm of 1 or more kinds of an ammonium salt, alkali metal salt and amine salt of a high molecular weight polycarboxylic acid having a weight average molecular weight of 500-50,000 that is a polyacrylic acid or a copolymer between an α-olefin and maleic acid, and which has a pH of 6-9. This cutting or grinding processing of highly brittle materials can suitably be employed for the cutting or grinding processings, especially for the cutting, precision polishing or dicing processings, of highly brittle materials including glass, ceramic or silicon in particular.;COPYRIGHT: (C)2006,JPO&NCIPI