DRAWING METHOD OF CIRCUIT PATTERN AND CIRCUIT SUBSTRATE MANUFACTURED BY USING ITS METHOD

摘要

PROBLEM TO BE SOLVED: To provide a drawing method suitable for an industrial use of manufacturing a circuit substrate in which a drawing nature and adhesiveness are reconciled using as a drawing device, a dispenser with drawing functionality, an ink jet device, etc.;SOLUTION: In the drawing method of a wiring pattern on the substrate by dropping a solution including an electric conductive component; an oxygen element is included in the substrate on the front surface, the substrate with a critical surface tension smaller than 25 dyn/cm in 25°C of the front surface is used, and the solution with the larger surface tension force than the above critical surface tension is used for the solution.;COPYRIGHT: (C)2006,JPO&NCIPI