FORMATION METHOD OF DIVIDING POSITION RECOGNITION MARK, AND SEMICONDUCTOR CIRCUIT BOARD, MANUFACTURING METHOD OF SAME, AND BASE MATERIAL OF SAME, AND LIQUID CRYSTAL DISPLAY PANEL BOARD, LIQUID CRYSTAL DISPLAY, AND MANUFACTURING METHOD OF SAME

摘要

PROBLEM TO BE SOLVED: To provide a solving method for improving the yield lowered by burr or chip caused by the stress at the time of division, in the process for dividing a semiconductor circuit board base material for every semiconductor circuit board region in which the semiconductor circuit pattern is formed.;SOLUTION: The formation method for forming a dividing position recognition mark forms a recognition mark 1 so as to recognize the dividing position in the vicinity of a division line 3 for dividing every semiconductor circuit board region in the semiconductor circuit board base material which is classified into two or more individual semiconductor circuit board regions. The dividing position recognition mark 1 is configured so that the part which approaches most closely to the division line 3 in the dividing position recognition mark 1 may be formed in a shape which becomes one point (or line of 120 m).;COPYRIGHT: (C)2006,JPO&NCIPI