DIE FOR PROCESSING BASE PLATE, MANUFACTURING METHOD OF PROCESSED PLATE AND MANUFACTURING METHOD OF PRODUCT PLATE

摘要

PROBLEM TO BE SOLVED: To restrain breakage of printed wiring base board lowering of die strength and life in the case of manufacturing a packaging board including printed circuit boards opposite to each other at a relatively short space through a relatively long straight line part by push-back processing.;SOLUTION: In a first push-back area 3, push-back processing is performed for first printed circuit boards (A) 14a, 14a. Subsequently, the base board 10 is conveyed to perform push-back processing for new first push-back board (B) and a second printed circuit board (A) 14a', 14a', ... in the first push-back area 3 and a second push-back area 7. Further the base board 10 is conveyed to perform push-back for new first printed circuit board (C) and the second printed circuit board (B) 14b' in the first push-back area 3 and a second push-back area 7, and simultaneously pick a packaging board 18 in an outline cutting area 5.;COPYRIGHT: (C)2006,JPO&NCIPI