METHOD FOR SUPPRESSING PRODUCTION OF WHISKER FROM TIN OR TIN ALLOY PLATING LAYER, AND CONTACT MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a technique for suppressing production of whiskers from tin/tin alloy solder.;SOLUTION: In tin (tin alloy) plating layers provided on a substrate, as the lower layer, a tin (tin alloy) lusterless plating layer is provided, and, as the upper layer, a tin (tin alloy) lustrous plating layer is provided. It is also possible that the diffusion of a Cu component is prevented by a barrier plating film.;COPYRIGHT: (C)2006,JPO&NCIPI