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It is brief in constituting the memory cell and the relation channel effect reduction manner

机译:构成存储单元和关系沟道效应降低方式简述

摘要

According to one edge strip of this invention, production manner of floating gate die memory array the 1st source field (116,216,316) and is provided between the 2nd source field, (118,218) in order to make the trench expose (128,228) which stipulates the side wall (150,250) of the substrate (258,358), includes the process (404) which removes the dielectric from the isolation region (110) which is provided in the aforementioned substrate. This production manner furthermore includes the process (406) which injects the N die dopant which forms the N+ die field (252,352) the aforementioned 1st source field (116,216,316) and the aforementioned 2nd source field (118,218,318) and vis-a-vis with the aforementioned side wall (150,250). As for this production manner furthermore, it possesses with the process (408) which injects the P-type dopant which forms the P+ die field (256,356) which is provided in lower part of the aforementioned N+ die field (252,352) the aforementioned 1st source field (116,216,316) and the aforementioned 2nd source field (118,218) and vis-a-vis with the aforementioned side wall (150,250).
机译:根据本发明的一个边缘条,浮栅管芯存储器阵列的制造方式是在第一源极场(116,216,316)和第二源极场(118,218)之间提供,以使规定侧面的沟槽暴露(128,228)。衬底(258,358)的壁(150,250)包括工艺(404),该工艺(404)从设置在上述衬底中的隔离区(110)去除电介质。该生产方式还包括步骤(406),该步骤注入形成N +管芯场(252,352)的N管芯掺杂剂,所述N +管芯场(252,352)与前述第一源场(116,216,316)和前述第二源场(118,218,318)相对。前述侧壁(150,250)。此外,对于该制造方式,通过工序(408),注入形成在上述N +芯片场(252,352)的下部的P +芯片场(256,356)的P型掺杂剂。场(116,216,316)和上述第二源场(118,218)以及与上述侧壁(150,250)相对。

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