首页> 外国专利> METHOD FOR BAKING METALLIC PARTICLE FOR MUTUALLY FUSING METALLIC PARTICLE BY HIGH-FREQUENCY ELECTROMAGNETIC-WAVE IRRADIATION AND ELECTRONIC PART AND MATERIAL FOR BAKING METALLIC PARTICLE MANUFACTURED BY USING ITS METHOD

METHOD FOR BAKING METALLIC PARTICLE FOR MUTUALLY FUSING METALLIC PARTICLE BY HIGH-FREQUENCY ELECTROMAGNETIC-WAVE IRRADIATION AND ELECTRONIC PART AND MATERIAL FOR BAKING METALLIC PARTICLE MANUFACTURED BY USING ITS METHOD

机译:高频电磁波辐射和电子零件的金属颗粒相互融合的金属颗粒的烘烤方法以及使用该方法制造的金属颗粒的烘烤材料

摘要

PROBLEM TO BE SOLVED: To provide a new technique capable of preparing a mounting part having a low resistance in a short time even on a substrate material having a low heat resistance and a product manufactured by using the technique, and a material for baking metallic particles for mutually fusing the metallic particles used for the technique in a direct circuit drawing method using the metallic particles.;SOLUTION: There is provided a method for mutually fusing the metallic particles selectively heating a metallic particle by surface-coating or circuit-patterning the metallic particles 2 excellent in high-frequency electromagnetic-wave absorptivity or the metallic particles 2 mixed with a sintering assistant excellent in high-frequency electromagnetic-wave absorptivity, on various substrates 1, and conducting a high-frequency electromagnetic-wave irradiation. There are provided an electronic mounting part such as a conductive material, a conductive path, an antenna, a bump, a pad, a via or the like and a solid wiring board and a thermal conductive path, a catalytic electrode and a solid wiring formed by using the method.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种即使在耐热性低的基板材料上也能够在短时间内制备具有低电阻的安装部件的新技术,以及使用该技术制造的产品,以及用于烘烤金属粒子的材料用于在使用该金属粒子的直接电路图绘制方法中相互融合用于该技术的金属粒子。;解决方案:提供了一种通过对金属粒子进行表面涂层或电路图案化来选择性地加热金属粒子的相互融合的方法在各种基板1上,高频电磁波吸收性优异的金属粒子2或与高频电磁波吸收性优异的烧结助剂混合的金属粒子2,进行高频电磁波照射。提供了一种电子安装部件,例如导电材料,导电路径,天线,凸块,焊盘,过孔等以及固体线路板,以及形成的导热路径,催化电极和固体配线COPYRIGHT:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2006269984A

    专利类型

  • 公开/公告日2006-10-05

    原文格式PDF

  • 申请/专利权人 FURUKAWA ELECTRIC CO LTD:THE;

    申请/专利号JP20050089593

  • 发明设计人 HARADA TAKUYA;FUJIWARA HIDEMICHI;

    申请日2005-03-25

  • 分类号H05K3/10;B05D3/06;B05D7/24;H01B5/14;H01B13/00;H01L21/288;H01L21/3205;

  • 国家 JP

  • 入库时间 2022-08-21 21:53:09

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号