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NICKEL PLATING BATH FOR BARREL PLATING AND BARREL PLATING METHOD USING THE BATH

机译:镀镍镀液槽及使用镀槽的镀液方法

摘要

PROBLEM TO BE SOLVED: To develop a plating bath where, at the time of applying barrel plating to compact or low specific gravity parts, a nickel film can be uniformly formed thereon.;SOLUTION: At the time when barrel plating is performed in such a manner that an oligo-molecular specific compound of fatty alcohols or ethers in which ethylene oxide or propylene oxide unit is repeated by 1 to 4 pieces, and having hydrogen or C1 to C4 alkyl radicals or C1 to C2 alkyl radicals on both the ends such as 2-methoxy ethanol, diethylene glycol monomethyl ether, dipropylene glycol and 1,2-dimethoxy ethane on both the ends is added to a nickel plating bath, wettability can be improved even to electronic parts largely including compact or low specific gravity parts floating in a plating bath, and the nickel plating film can be uniformly formed thereon.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:开发一种电镀液,在将滚镀工艺应用于致密或低比重零件时,可以在其上均匀地形成镍膜。;解决方案:在这种情况下进行滚镀工艺时环氧乙烷或环氧丙烷单元重复1-4且具有氢或C 1 至C 4 的脂肪醇或醚的低分子特定化合物的方式两端的Sub>烷基或C 1 到C 2 烷基,例如2-甲氧基乙醇,二甘醇单甲醚,二丙二醇和1,2-二甲氧基将两端的乙烷都添加到镀镍浴中,即使对于很大一部分包括漂浮在镀浴中的紧凑或低比重部件的电子零件,也可以提高润湿性,并且可以在其上均匀地形成镀镍膜。 C)2006,日本特许厅

著录项

  • 公开/公告号JP2006037164A

    专利类型

  • 公开/公告日2006-02-09

    原文格式PDF

  • 申请/专利权人 ISHIHARA CHEM CO LTD;

    申请/专利号JP20040218520

  • 申请日2004-07-27

  • 分类号C25D3/12;C25D7/00;C25D17/16;

  • 国家 JP

  • 入库时间 2022-08-21 21:51:48

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