Composite leadframe LED package and method of manufacturing the same This application is US Provisional Patent Application No. 60 / 431,523, filed December 6, 2002, entitled 'Leadframe based LEDor semiconductor packaging package'. Claims the benefit of filing date to the US Patent and Trademark Office.

摘要

Light emitting die package (10) is disclosed. The die package (10) includes a leadframe (20), a bottom heatsink (30), a top heatsink (40), a reflector (60) and a lens (70). The top and bottom heatsinks (40 and 30) are thermally coupled but electrically insulated from the leadframe (20). The leadframe (20) includes a plurality of leads (22) and defines a mounting pad (28) for mounting LEDS (50). The top heatsink (40) defines an opening (42) over the mounting pad (28). The reflector (60) is coupled to the top heatsink (40) at the opening (42). The lens (70) is placed over the opening (42) defining an enclosed cavity (44) over the mounting pad (28). At least one light emitting diode (50) is mounted on the mounting pad (28) within the cavity (44). Encapsulant optically couples the LED (50) to its surrounding surfaces to maximize its optical Performance. When energized, the LED (50) generates light and heat. The light is reflected by the reflector (60) and operated on by the lens (70). The heat is dissipated by the top and the bottom heatsinks (40 and 30).