Both sides cooling die semiconductor mosquito - domojiyu - ru and the refrigerant indirect cooling die semiconductor equipment which uses that

摘要

To provide a both-face cooling type semiconductor card module which can be strongly cooled from both the faces of a semiconductor chip. SOLUTION: Since a pair of HEAT transfer members 5 and 6 joined individually ON both the main faces of semiconductor chips 2 and 3 are covered by a ceramic thin film 11 respectively, both the HEAT transfer members 5 and 6 can be simultaneously cooled by the refrigerant tube 100 of the same electric potential of the evaporator of a refrigerating cycles device 100, a semiconductor device capable of remarkably large current energization as compared with the conventional can be realized.