Suffering arrival making multiple luminous elements

摘要

PROBLEM TO BE SOLVED: To provide a superior-productivity light emitting element array chip which can effectively prevent generation of 'chipping', and an optical printer head.;SOLUTION: The light emitting element array chip 5 is constituted by applying and arranging a plurality of light emitting elements 2 linearly onto an upper face of a semiconductor substrate 1. The plurality of light emitting elements 2 are coated in common with a protecting layer 3 formed of a light transmissive resin, and at the same time, both end parts of the protecting layer 3 are extended to be more outside than a side face of the semiconductor substrate 1. A Young's modulus of the light transmissive resin for forming the protecting layer 3 is set to be 0.1-10 GPa.;COPYRIGHT: (C)2003,JPO